三星最新旗舰机型Galaxy S III已经正式在很多国 家发售，知名拆解网站iFixit也为我们带来了拆解过程。三星Galaxy S III的确搭载了一颗32纳米工艺的Exynos四核处理器，主频为1.4GHz。此外Galaxy S III的摄像头是来自索尼的IMX145，像素为800万，背光CMOS图像传感器。该芯片与苹果iPhone 4S中的摄像头组件相同。 Samsung Exynos 4412 quad-core A9 processor with 1GB LP DDR2 Green Memory (K3PE7E700M-XGC2) Murata M2322007 WiFi Module Samsung KMVTU000LM eMMC(16GB)+MDDR(64MB) NAND Flash Intel Wireless PMB9811X Gold Baseband processor MAX77693 and MAX77686 Broadcom BCM47511 Integrated Monolithic GNSS Receiver Wolfson Microelectronics WM1811 stereo codec Skyworks SKY77604 Multi-Band Power amplifier Silicon Image 9244 low-power MHL Transmitter NXP PN544 NFC Chip Infineon PMB5712 RF transceiver
